Inspur i24

Brand-new 2U 4xNodes High-density Server for Data Center

Key Features

Product Overview

Inspur i24 is a 2U multi-node rack-mounted server optimized for brand-new high-density data centers and applications.

The i24 enclosure can support 4x 1U half-width 2-socket nodes (NS5162M5) and each node is connected to the enclosure through the sideplane card.

Maintaining Inspur servers’ consistent high-quality and reliable performance and having the highest computing density, ideal scalability and management features among all similar or competing products, i24 is especially suitable for large and medium-sized enterprises, Internet and communications industries that have strict requirements of servers. Due to its distinctive system design, i24 achieves a perfect combination of high density, efficiency, reliability and intelligence within the limited space. i24 is suitable for compute-intensive, distributive, converged computing/storage and mission-critical applications that have high computing, storage and communication demands, such as HPC, cloud computing, HCI. It is a perfect match to the new generation of high-density data centers.

According to different application scenarios, Inspur i24 maintains consistent high-quality and reliable performance and applies ultimate design concept to high density, computing performance, availability, reliability and maintainability.

High Density & Computing Performance

▪ The 2U enclosure supports 4x 2-socket half-width server nodes.

▪ 2x New Generation Intel® Xeon® scalable processors per node (TDP up to 205W).

▪ 2x NVDIMMs per node. Besides, Each node supports up to 16x 2666 MT/s DDR4 ECC (enabling RDIMM and LRDIMM), and offers 1TB memory of excellent speed and availability.

▪ 24x hot-swap NVMe drives and the extreme storage I/O brings a leap in storage performance.

High Availability

▪ i24 supports up to 24x 2.5" or 12x 3.5" SAS/SATA HDD/SSDs for mass storage, and 2x built-in SATA M.2 for OS installation.

▪ i24 supports hot-swap SAS/SATA HDD/SSDs, RAID 0/1/1E/10/5/50/6/60, RAID cache, and SuperCap power-down data protection.

▪ Each node supports 3x PCI-E slots and Intel Integrated I/O technology. The PCI-E 3.0 controller is integrated into the Intel® Xeon® scalable processor, causing significant decrease in I/O latency and improvement in the overall system performance.

▪ i24 supports free OCP/PHY switch and offers 1G/10G/25G/40G network interface options to achieve even flexible network for applications.

High Reliability

• The entire enclosure shares 2x 2000W redundant power supplies and the optimized PSU design is more efficient and energy-saving. Inspur unique intelligent control technology and the advanced air-cooling system secure the best working environment and ensure stable system operation.

• i24 has 4x system fans in the middle of the enclosure. They support regional speed regulation, PID (Proportional-Integral-Derivative) speed regulation and intelligent CPU FM. Such a fully optimized system cooling design is energy efficiency.

• i24 supports encrypted TPM security chip to guarantee data and information system security.

High Maintainability

• The embedded intelligent management chip supports IPMI2.0 and Redfish. It helps to fulfill complete remote system monitor, remote KVM, virtual media and all management tasks.

▪ With the CMC module, i24 supports united management of power supplies and fans within the enclosure and enables the access to the node monitoring information. This simplifies device management in the data center environment. With the support of Inspur light path diagnostics, the administrator can quickly detect the failing part which consequently reduces the administrator’s pressure and improve efficiency.

▪ i24 embodies human design with tool-less maintenance for the entire enclosure, easy disassembly, and shortened operation and maintenance time.

Technical Specifications

Node parameters


Dual socket 2* Intel® Xeon® series scalable processors


C622, C624, C627


Supports 16* DDR4 RDIMM/LRDIMM, up to 2400/2666/2933 Mhz, and supports AEP memory

I/O port

Expands via SUV to 2* USB 2.0 ports, 1* VGA port, and 2* serial ports

Display controller

Consists of Aspeed2500 chips,64M frame buffer, resolution up to 1280 x 1024

RAID controller

SATA controller on motherboard (supports RAID 0/1/5/10)

Standard PCIe RAID controller RAID 0/1/10/1E/5/6/10/50

Network card controller

Supports 1* standard OCP card or PHY card

Management port

1* dedicated 1000Mbps network port for remote management.

BMC -Aspeed AST2500- 1GB SDRAM

BMC -Aspeed AST1250- 512MB SDRAM

PCIe expansion slot

3* PCI-E 3.0 x16 expansion slots:

Supports horizontal slot cards as well as low-profile and half-length cards through riser adapter cards.

A riser adapter card installed at riser slot 1 and slot 2 (CPU0) supports 1* PCIe 3.0 x16 slot.

1* standard OCP2.0 card or PHY card slot on motherboard


2* M.2 SSDs

Server parameters

Front hard drive slots (6* 2.5” or 3*3.5” per node)

2.5” NVMe backplane

2.5” NVMe + SAS backplane

3.5” NVMe backplane

Power supply

2*2000W 80Plus platinum power supply supports 1+1 redundancy (supports 1+1 redundancy under certain conditions, please check according to actual configurations)

100 V to 250 V AC or 192 V to 300 V DC (Please follow the power input value specified on the label on the host)


4* 80mm cooling fans in the middle of the chassis

Mainframe size

2.5” chassis: 446 mm (w) × 87.5 mm (h) × 805 mm (d)

3.5” chassis: 446 mm (w) × 87.5 mm (h) × 805 mm (d)

Package size  721 mm (w) × 279 mmm (h) × 1168 mm (d)

Product weight

Full load gross weight of 2.5” chassis: 40.5 kg/53 kg (includes server + package + rail kit + components box)

Full load gross weight of 3.5” chassis: 42.9 kg/58 kg (includes server + package + rail kit + components box)

Operating temperature


Chassis airflow requirements


Storage temperature

Packed: -40°C~+70°C

Unpacked: -40°C~+55°C


Operating humidity: 10%~90% R.H.

Storage humidity: 10%~93% R.H.

Noise (Bels)

(Sound power) 4,5,6,7


LWAd: 6.7 B for normal configuration;

LpAm: 54 dBA for normal configuration;


LWAd: 7.2 B for normal configuration;

LpAm: 59.7 dBA for normal configuration;


Operating temperature: 5°C~45°C at 0~914 m (3000 ft);

Operating temperature: 10°C~32°C at 914~2133 m (7000 ft);


IEC 60950-1:2005 (Second Edition); Am1:2009 + Am2:2013

IEC 60950-1:2005

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

UL 60950-1 and CAN/CSA C22.2 No. 60950-1-07 standards for information Technology Equipment-Safety-Part 1: General Requirements TC 004/2011

IS 13252(PART 1):2010/ IEC 60950-1: 2005


EN 55032:2015

EN 61000-3-2:2014

EN 61000-3-3:2013

EN 55024:2010+A1:2015

EN 55035:2017

AS/NZS CISPR 32:2015

CFR 47 FCC Part 15 subpart B, 2018

ICES-003 ISSUE 6:2016

TC 020/2011





i24 Datasheet.pdf

i24 NS5162M5.pdf

Inspur i24