2020 OCP(Open Compute Project) China Day

28 December 2020

On November 13, the OCP China Day Technology Summit was held in Beijing. There were more than 600 IT engineers and data center practitioners from Facebook, Intel, Microsoft, Inspur, Baidu, Tencent, Ali, NVIDIA, Nokia, China Mobile, Seagate, and Suiyuan Technology participated in this conference. They shared the latest developments and innovative practices in Open Compute Project.

Open Compute Project

The application and development of 5G and AI have brought more emerging scenarios to data centers. In the OCP open computing community, OAI, OpenEdge and SONiC are becoming the key directions of the new wave of open computing industrialization. These technologies are getting a positive response from the OCP (Open Compute Project) community.

The OAI open model promotes AI technology innovation. OCP allows AI computing to be integrated into the next generation data center. The development of OAI open standards has greatly stimulated the integration and innovation of AI computing infrastructure. At present, the open technical specifications promoted by the OAI (Open Accelerator Infrastructure) group of the OCP community. It involving 9 key areas such as OAI, OAM, UBB, HIB, etc., covering many aspects such as structural design, temperature, management, power supply, hardware safety, and availability. It aims to solve the hardware fragmentation and ecological fragmentation in the construction of AI computing infrastructure by establishing a set of technical standards compatible with various AI accelerators. Currently, Baidu, Facebook, Microsoft, Inspur and other companies are members of the OAI team.

Inspur have completed the adaptation on Inspur OAI system with OAM member manufacturers Intel Habana and Suiyuan Technology. Based on the OAM standard, Inspur has formulated the UBB SPEC design specification, which greatly improves the compatibility of various AI acceleration chips specification. At present, a series of products such as Baidu's X-MAN4.0, Inspur's MX-1, and Suiyuan Technology's T11 have already support the OAM standard.

The development of 5G and AI has allowed the large-scale development of data centers, and activate the diversified needs of edge computing application scenarios. OCP and ODCC are unanimously actively promoting edge computing, setting up OpenEdge and OTII project teams respectively. As an important project group of the OCP community, OpenEdge has formulated the world's first universal edge server standard. It solves the basic problem of the convergence of edge server specifications and telecommunications specifications. As a common member of OTII and OpenEdge, Inspur has developed a variety of edge computing solutions such as edge micro data centers, edge cloud servers, and edge AI servers. These solutions have been applied in multiple fields such as mining, petroleum, industrial Internet, and smart cities.

The growth of AI, data analysis, and high-performance computing has accelerated the evolution of data centers to software-defined infrastructure. Data center network transmission needs to be more intelligent, automated, high-performance, highly reliable, and flexible. As a sub-project of the OCP OPEN NETWORK project team, SONiC has delivered about 15 new feature sets in the past six months, including the functions such as D-BUS for container and host communication, dynamic port splitting, and port mirroring. The team also plans to deliver 35 new features and enhancements in the next six months. The SONiC community will present more convenient functions to the industry, such as support for 400G networks, Chassis scenarios, Kubernetes management, high-speed RDMA, and security modules.